مرکز منطقه ای اطلاع رساني علوم و فناوري - Electrocoagulation of chemical mechanical polishing (CMP) wastewater from semiconductor fabrication

Title of article :

Electrocoagulation of chemical mechanical polishing (CMP) wastewater from semiconductor fabrication

Author/Authors :

Chen L. Lai، نويسنده , , Sheng H. Lin، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2003

Pages :

From page :

205

To page :

211

Keywords :

Semiconductor CMP wastewater , Electrocoagulation , Copper and COD removal , Turbidity reduction

Journal title :

Chemical Engineering Journal

Serial Year :

2003

Journal title :

Chemical Engineering Journal

Record number :

365782

Link To Document :