مرکز منطقه ای اطلاع رساني علوم و فناوري - Kinetics study of thermal decomposition of electronic packaging material

Title of article :

Kinetics study of thermal decomposition of electronic packaging material

Author/Authors :

Tzong-Horng Liou، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2004

Pages :

From page :

To page :

Keywords :

Electronic packaging material , thermal decomposition , Kinetics , silica , Mechanism

Journal title :

Chemical Engineering Journal

Serial Year :

2004

Journal title :

Chemical Engineering Journal

Record number :

365835

Link To Document :