Title of article :
THERMODEL: A Tool for Thermal Model Generation, and Application for MEMS
Author/Authors :
V. Székely، نويسنده , , A. Poppe and M. Rencz ، نويسنده , , A. Poppe and B. Courtois ، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
Pages :
11
From page :
49
To page :
59
Keywords :
package modeling , MEMS modeling , Thermal modeling , reduced order modeling
Journal title :
Analog Integrated Circuits and Signal Processing
Serial Year :
2001
Journal title :
Analog Integrated Circuits and Signal Processing
Record number :
367179
Link To Document :
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