Title of article :
THERMODEL: A Tool for Thermal Model Generation, and Application for MEMS
Author/Authors :
V. Székely، نويسنده , , A. Poppe and M. Rencz ، نويسنده , , A. Poppe and B. Courtois ، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
Keywords :
package modeling , MEMS modeling , Thermal modeling , reduced order modeling
Journal title :
Analog Integrated Circuits and Signal Processing
Journal title :
Analog Integrated Circuits and Signal Processing