Title of article
Comparison of Transient Thermal Parameters for Different Die-Connecting Approaches
Author/Authors
Jian Yin، نويسنده , , Jacobus Daniel van Wyk، نويسنده , , and Willem G. Hardus Odendaal، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
9
From page
1403
To page
1411
Keywords
equivalent thermal circuit , thermalimpedance , thermal transient measurement. , comparison
Journal title
IEEE Transactions on Industry Applications
Serial Year
2006
Journal title
IEEE Transactions on Industry Applications
Record number
381995
Link To Document