Title of article :
Comparison of Transient Thermal Parameters for Different Die-Connecting Approaches
Author/Authors :
Jian Yin، نويسنده , , Jacobus Daniel van Wyk، نويسنده , , and Willem G. Hardus Odendaal، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Pages :
9
From page :
1403
To page :
1411
Keywords :
equivalent thermal circuit , thermalimpedance , thermal transient measurement. , comparison
Journal title :
IEEE Transactions on Industry Applications
Serial Year :
2006
Journal title :
IEEE Transactions on Industry Applications
Record number :
381995
Link To Document :
https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=381995
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