Title of article
Crossing the planes at high speed. Signal integrity issues at split ground and power planes
Author/Authors
Liaw، نويسنده , , H.-J.، نويسنده , , Merkelo، نويسنده , , H.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1997
Pages
5
From page
22
To page
26
Abstract
This article discusses a specific design situation that represents quite a broad class of problems in the study of signal integrity. The article focuses on the effects on high-speed signals that need to cross split ground planes and split power planes that act as signal references or partial references. Such configurations are frequently needed in the layout of printed circuit boards (PCBs), multichip modules (MCMs), and even single-chip modules. Examples of split ground and power planes are discussed first. The conventional effective inductance model is described briefly, and an accurate and efficient transmission line model is then discussed in detail. Examples of modeling and design trade-offs are also presented
Journal title
IEEE Circuits and Devices Magazine
Serial Year
1997
Journal title
IEEE Circuits and Devices Magazine
Record number
397296
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