Dealing with the heat. Selecting a good thermal interface for reliable chip performance

The need for keeping the package at acceptable temperatures has become a critical issue in recent years. To aid in the cooling of their modules, many electronics manufacturers have implemented the use of heat sinks. Thermal interfaces placed between the package and the heat sink to aid in heat dissipation have become increasingly more important and the demands on these interfaces have increased significantly. During the selection of interface materials many factors must be considered. Compliance, conformability, modulus, ease of installation, and cut-through resistance are all important