Cupping of wooden cladding boards in cyclic conditions—A study of heat-treated and non-heat-treated boards

The aim of the study was to examine how the thickness and heat-treatment of cladding boards affects cupping during cyclic conditions. The study was conducted with heat-treated and non-heat-treated cladding boards in laboratory conditions. On the basis of the results, thickness and heat-treatment both have a significant influence on cupping of the board. The cupping of heat-treated board was considerably lower than that of non-heat-treated board.