Failure analysis of solder joints with a damage-coupled viscoplastic model

This paper presents failure analysis of solder joints with a damage-coupled viscoplastic model. A material model is developed to characterize the elasticity, plasticity, creep and damage of solder. A semiimplicit time-integration approach is adopted for the numerical implementation of the solder model. This solder model has been implemented into nite element codes developed at Sandia National Laboratories and into the commercial, nite element code ABAQUSTM with its user-de ned material subroutine UMAT. Finite element analyses are performed on solder joints with the new solder constitutive model and mesh dependency of these analyses is investigated