Title of article
Some Thermal Properties of a Copper–Tin Alloy
Author/Authors
B. J. Monaghan ، نويسنده , , J. G. J. Neale and L. Chapman ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
10
From page
1051
To page
1060
Abstract
The thermal properties (heat capacity, thermal diffusivity, and electrical
resistivity) of a Cu + 10 wt% Sn alloy in both solid and liquid phases have been
reported. Using these values it was confirmed that the Lorenz relation is suitable
for obtaining thermal conductivity from electrical resistivity in the liquid phase
of this alloy. Also, the temperature differential (dX/dT) obtained from such an
approach was in excellent agreement with the thermal conductivity values
calculated from thermal diffusivity.
Keywords
liquid metals , Copper , Liquid alloys , Lorenz relation , thermal conductivity , thermal diffusivity , resistivity , tin.
Journal title
International Journal of Thermophysics
Serial Year
1999
Journal title
International Journal of Thermophysics
Record number
426539
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