Title of article :
Measurement of Solder/Copper IInterfacial Thermal Resistance by the Flash Technique
Author/Authors :
J. G. Bai، نويسنده , , Z. Z. Zhang، نويسنده , , G.-Q. Lu and D. P. H. Hasselman ، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2005
Abstract :
A feasibility study was conducted to determine the iInterfacial thermal resistance
(ITR) in both bi- and tri-layered eutectic lead–tin solder/copper specimens
by the flash technique. The solder/copper ITR results of the two sets of
specimen showed excellent agreement. The values were found to range from
0.011 to 0.033K·cm2 ·W−1 with an average of about 0.020K·cm2 ·W−1. The
variation was attributed primarily to the imperfection of the solder/copper
bonding established by scanning acoustic microscopy.
Keywords :
flash technique , transient thermal analysis. , iInterfacial thermalresistance , scanning acoustic microscopy , Finite element analysis
Journal title :
International Journal of Thermophysics
Journal title :
International Journal of Thermophysics
