Title of article :
IC Failure Analysis: Magic, Mystery, and Science
Author/Authors :
Jerry M. Soden، نويسنده , , Richard E. Anderson، نويسنده , , Chris L. Henderson
، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1997
Abstract :
Advancing IC and packaging technologies motivate and direct the future of failure analysis. The authors review current tools and techniques and discuss challenges and opportunities created by the industryʹs critical need for new diagnosis and failure analysis paradigms
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers
