• Title of article

    Analyzing Packaging Trade-Offs During System Design

  • Author/Authors

    Peter A. Sandborn، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1998
  • Pages
    10
  • From page
    10
  • To page
    19
  • Abstract
    Integrating packaging trade-off analysis with functional verification and architectural design results in a complete virtual prototyping solution far optimizing complex electronic systems. The authors discuss the role of packaging costs in system design and present examples highlighting packaging design trade-offs
  • Journal title
    IEEE Design and Test of Computers
  • Serial Year
    1998
  • Journal title
    IEEE Design and Test of Computers
  • Record number

    431192

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=431192