Title of article :
Analyzing Packaging Trade-Offs During System Design
Author/Authors :
Peter A. Sandborn، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1998
Pages :
10
From page :
10
To page :
19
Abstract :
Integrating packaging trade-off analysis with functional verification and architectural design results in a complete virtual prototyping solution far optimizing complex electronic systems. The authors discuss the role of packaging costs in system design and present examples highlighting packaging design trade-offs
Journal title :
IEEE Design and Test of Computers
Serial Year :
1998
Journal title :
IEEE Design and Test of Computers
Record number :
431192
Link To Document :
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