Title of article :
Modeling and Optimizing the Costs of Electronic Systems
Author/Authors :
Michael Scheffler
، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1998
Abstract :
Todayʹs high-density packaging technologies make early attention to most factors essential in the design of successful products. A process-oriented, scalable cost-modeling tool, the Modular Optimization Environment (MOE), enables a continuous cost-quality-performance trade-off analysis throughout the design and manufacturing process
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers