Author/Authors :
Shiming Liu and Chong Zhao، نويسنده , , University of California، نويسنده , , San Diego
Sujit Dey، نويسنده , , University of California، نويسنده , , San Diego
Xiaoliang Bai، نويسنده , , Cadence Design Systems، نويسنده ,
Abstract :
Soft-spot analysis identifies regions in a circuit that are most susceptible to multiple noise sources and their compound effects so that designers can harden those spots for greater robustness. HSpice simulation validates the methodologyʹs quality, and demonstration on a commercial embedded processor shows its scalability.
