Title of article
System-in-Package Testing: Problems and Solution
Author/Authors
Davide Appello، نويسنده , , STMicroelectronics Paolo Bernardi، نويسنده , , Politecnico di Torino Michelangelo Grosso، نويسنده , , Politecnico di Torino Matteo Sonza Reorda، نويسنده , , Politecnico di Torino ، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
9
From page
203
To page
211
Abstract
System-in-package integrates multiple dies in a common package. Therefore, testing SiP technology is different from system-on-chip, which integrates multiple vendor parts. This article provides test strategies for known good die and known good substrate in the SiP. Case studies prove feasibility using the IEEE 1500 test structure
Journal title
IEEE Design and Test of Computers
Serial Year
2006
Journal title
IEEE Design and Test of Computers
Record number
431664
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