Author/Authors :
Dong Gun Kam، نويسنده , , Korea Advanced Institute of Science and Technology
Joungho Kim، نويسنده , , Korea Advanced Institute of Science and Technology
Jiheon Yu، نويسنده , , Amkor Technology Korea
Ho Choi، نويسنده , , Amkor Technology Korea
Kicheol Bae، نويسنده , , Amkor Technology Korea
Choonheung Lee، نويسنده , , Amkor Technology Korea
، نويسنده ,
Abstract :
System-in-package provides highly integrated packaging with high-speed performance. Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds. In a high-frequency spectrum, these wire bonds can cause discontinuities causing signal degradation. This article addresses problems with wire bonding in high-frequency SiP packages and proposes design methodologies to reduce these discontinuities
