Title of article :
Is System in Package the Panacea for Integration?
Author/Authors :
T.M. Mak، نويسنده , , Intel، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Abstract :
With technology scaling, nature has not been kind to conventional analog circuit design. System in package seems the obvious way to go. But its predecessor was the multichip module, and basically, all the problems are still there. The author discusses where to go from here.
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers