• Title of article

    Is System in Package the Panacea for Integration?

  • Author/Authors

    T.M. Mak، نويسنده , , Intel، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2006
  • Pages
    1
  • From page
    256
  • To page
    256
  • Abstract
    With technology scaling, nature has not been kind to conventional analog circuit design. System in package seems the obvious way to go. But its predecessor was the multichip module, and basically, all the problems are still there. The author discusses where to go from here.
  • Journal title
    IEEE Design and Test of Computers
  • Serial Year
    2006
  • Journal title
    IEEE Design and Test of Computers
  • Record number

    431670

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=431670