Title of article :
Hierarchical Test Compression for SoC Designs
Author/Authors :
Kee Sup Kim، نويسنده , , Intel
Ming Zhang، نويسنده , , Intel
، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Abstract :
Capitalizing on the larger capacity of todayʹs ICs, designers are using yesterdayʹs chips as modules in todayʹs chips. DFT methodologies, which usually work on a large, flat design, must begin to take this reuse into account. This article shows how to use the X-compact compression technique in a hierarchical environment.
Journal title :
IEEE Design and Test of Computers
Journal title :
IEEE Design and Test of Computers