Title of article
The stress intensity factors of regularly perturbed-interface cracks of anisotropic bimaterials
Author/Authors
Chao-Hsun Chen، نويسنده , , Jinhon Hsu، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1997
Pages
19
From page
1235
To page
1253
Abstract
Based on Lekhnitskii-EshelbyStrolr (LES) representation and perturbation analysis,
analytic solutions are given for displacement and stress fields of two anisotropic half-planes, forming
a composite biiterial, with a perturbed-interface crack. Among various mathematical models
representing real cracks, the “thin cut” model is of special interest, since it requires the simplest
mathematical methods in its study. However, the model does not reflect some of the progerties of
actual cracks, in particular the crack should be uneven. When the lateral stresses, parallel to the
interface, dominate in the fracture mechanism, the thin-cut model cannot reveal any stress intensifying
phenomenon, while many failures, occurring in the interfaces of thin-Iihn and substrate or
fiber and matrix, are always induced by crucial lateral stresses. For these reasons, the unevenness
effect of crack faces must be taken into account to determine the practical stress intensity factors
for predicting the interface fracture behavior. A modified crack with smoothly perturbed surfaces
ensures good agreement with reality, while retaining the simplicity of the mathematical model.
Mathematically, we consider the elastic problem of a perturbed-interface crack lying along the
interfaue of two bonded dissimilar anisotropic half-planes and the uniform far-field stresses are
specifted. When the lateral stresses are much larger than others, the solutions am determined to the
first-order of unevenness to understand how the lateral stresses affect the stress intensity factors as
the crack face is uneven. 0 1997 Elsevier Science Ltd. All rights reserved
Journal title
International Journal of Solids and Structures
Serial Year
1997
Journal title
International Journal of Solids and Structures
Record number
446117
Link To Document