Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester

Most existing mechanical testers are at most bi!axial and in general too large for microelectronic materials and structures[ Existing mini testers are primarily single axis without any active specimen alignment moni! toring and adjustment capability[ Fundamental investigation needs to be conducted for packaging materials in terms of deformation and fracture processes\ constitutive laws\ and failure quantities[ In this paper\ a unique 5!axis sub!micron thermo!mechanical fatigue tester is described\ including some calibration work for both load cell and machine sti}ness[ For the _rst time\ an active specimen alignment monitoring and adjustment was demonstrated on a single lap shear sample\ assisted by a high resolution laser moire measurement system[ This paper also presents results for two types of polymer _lms\ one lead!free solder alloy\ and some other conventional materials[ In particular\ deformation and failure mechanisms for two polymer _lms have been discussed[ 0887 Elsevier Science Ltd[ All rights reserved[