Some problems in plane thermopiezoelectric materials with holes

Piezoelectric materials have recently attracted considerable attention due to their potential use in intelligent structural systems[ In this paper\ we treat the plane problem of thermopiezoelasticity with various holes and subject to coupled mechanical\ electric and thermal loads[ An analytical solution is obtained by applying the technique of conformal mapping and some identities in the Stroh formalism[ The solution has a simple uni_ed form for various holes such as ellipse\ circle\ triangle and square[ By way of the solution\ the expressions for the energy release rate and stress intensity factors of cracks are presented[ Numerical results for concentration coe.cients of stress and electric displacement along the hole boundary are given to assess the acceptability of the proposed method[ 0887 Elsevier Science Ltd[ All rights reserved