Adhesively bonded assemblies with identical nondeformable adherends and ‘piecewise continuous’ adhesive layer: predicted thermal stresses in the adhesive

We consider a thermoelastic problem for an elongated adhesively bonded assembly with identical nondeformable adherends and a `piecewise continuousʹ adhesive layer: the adhesive layer consists of a large number of `piecesʹ that di€er by their lengths, Youngʹs moduli, Poissonʹs ratios, and coecients of thermal expansion. Assemblies of this type are of interest in connection with the manufacturing, and mechanical and optical performance of some photonics structures. We develop a stress analysis model for the evaluation of thermally induced stresses, strains and displacements in the adhesive layer. These stresses are due to the thermal expansion (contraction) mismatch of the adhesive material with the material of the adherends, as well as to the mismatch between the adjacent `piecesʹ of the adhesive layer.