Interaction among interface, multiple cracks and dislocations

The interaction problem of a number of arbitrary oriented and distributed cracks and/or dislocations in bonded bimaterial half planes, are considered in a unified method. The basic solution of a single dislocation in a bonded half plane and the superposition technique, are used. The method has high accuracy and computational efficiency. It can treat the combined interaction of cracks, dislocations and interface. Several examples are given to show certain interaction effects, especially among cracks near an interface