A bending-to-stretching analysis of the blister test in the presence of tensile residual stress

The adhesion of films and coatings to rigid substrates is often measured using blister geometries, which are loaded either by an applied pressure or a central shaft.The measurement will be affected if there are residual stresses that make a contribution to the energy release rate.This effect is investigated using analytical solutions based on the principle of virtual displacements.A geometrically nonlinear finite element analysis is conducted for comparison.Furthermore, the relationships among strain energy release rate, load, deflection, and fracture radius are discussed in detail.Both analytical solutions and numerical results reveal that uniform tensile residual stresses reduce a specimen s deflection if it experiences plate behavior under small loads.However, this effect becomes negligible when membrane stresses induced by the loading become dominant.