The effects of boron impurities on the atomic bonding and electronic structure of Ni3Al

Soft X-ray emission spectroscopy has been used as a chemical probe in the characterization of thin film materials. Some examples of soft X-ray emission studies are presented to show the chemical sensitivity, site selectivity and depth dependence of this method. The substantial penetration of soft X-rays offers true bulk probing and facilitates studies of interfaces and buried structures. By choosing the proper geometry soft X-ray emission spectroscopy provides a non-destructive chemical analysis of sandwich structures. This technique has also been used to enable in situ and real-time characterization of thin films during vapor deposition growth.