Title of article :
Morphology and Growth Kinetics of Ag3Sn During Soldering Reaction Between Liquid Sn and an Ag Substrate
Author/Authors :
Su، Tl. نويسنده , , Tsao، L.C. نويسنده , , Chang، S.Y. نويسنده , , Chuang، T.H. نويسنده ,
Issue Information :
دوماهنامه با شماره پیاپی سال 2002
Pages :
-364
From page :
365
To page :
0
Abstract :
The application of arresters on transmission lines has been one of the most effective alternatives for the reduction of lightning flashover rates. This paper reviews previous methods for evaluating lightning performance of lines with arresters. Improved calculations of line outage rates are developed to include power frequency voltage and arrester failure-rate evaluations, based on field experience. The transmission lines are modeled in detail in the electromagnetic transients program (EMTP)/(ATP) and the outage rates are calculated with the Monte Carlo method. Probability energy stresses on arresters are evaluated for strokes on conductors and shield wires as a function of tower footing resistance (TFR).
Keywords :
interfacial reaction , kinetic analysis , target bonding , Ag3Sn intermetallic compound
Journal title :
Journal of Materials Engineering and Performance
Serial Year :
2002
Journal title :
Journal of Materials Engineering and Performance
Record number :
60261
Link To Document :
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