• Title of article

    Interfacial Reactions of Liquid Sn and Sn-3.5Ag Solders With Ag Thick Films

  • Author/Authors

    Su، Tl. نويسنده , , Tsao، L.C. نويسنده , , Chang، S.Y. نويسنده , , Chuang، T.H. نويسنده ,

  • Issue Information
    دوماهنامه با شماره پیاپی سال 2002
  • Pages
    -480
  • From page
    481
  • To page
    0
  • Abstract
    Feeding experiments were conducted quantitatively to examine the breakdown of mineral grains by earthworm, Eisenia feida, and larva of beetle, Protaetia lugubris insperata. Crushed and sieved test minerals of K-feldspar and/or quartz were mixed with artificial humus that contained no mineral grains. The mixture was fed to the soil animals in the plastic containers. After 1-, 4- and 7-day experimental durations, the ingested mineral grains were collected from the casts excreted by the soil animals in each container. Even 1 day after feeding of mineral grains, the casts of soil animals contained finer, rounded mineral grains that were not included in the initial prepared mineral samples.
  • Keywords
    Ag dissolution , Ag3Sn intermetallic compound , Sn/Ag , Ag thick film , Sn-3.5Ag/Ag , soldering reactions
  • Journal title
    Journal of Materials Engineering and Performance
  • Serial Year
    2002
  • Journal title
    Journal of Materials Engineering and Performance
  • Record number

    60275