Title of article
Interfacial Reactions of Liquid Sn and Sn-3.5Ag Solders With Ag Thick Films
Author/Authors
Su، Tl. نويسنده , , Tsao، L.C. نويسنده , , Chang، S.Y. نويسنده , , Chuang، T.H. نويسنده ,
Issue Information
دوماهنامه با شماره پیاپی سال 2002
Pages
-480
From page
481
To page
0
Abstract
Feeding experiments were conducted quantitatively to examine the breakdown of mineral grains by earthworm, Eisenia feida, and larva of beetle, Protaetia lugubris insperata. Crushed and sieved test minerals of K-feldspar and/or quartz were mixed with artificial humus that contained no mineral grains. The mixture was fed to the soil animals in the plastic containers. After 1-, 4- and 7-day experimental durations, the ingested mineral grains were collected from the casts excreted by the soil animals in each container. Even 1 day after feeding of mineral grains, the casts of soil animals contained finer, rounded mineral grains that were not included in the initial prepared mineral samples.
Keywords
Ag dissolution , Ag3Sn intermetallic compound , Sn/Ag , Ag thick film , Sn-3.5Ag/Ag , soldering reactions
Journal title
Journal of Materials Engineering and Performance
Serial Year
2002
Journal title
Journal of Materials Engineering and Performance
Record number
60275
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