Title of article
Roughness Analysis of CVD Cu Films on Different Substrates by AFM Imaging
Author/Authors
Alver، Umit نويسنده ,
Issue Information
دوماهنامه با شماره پیاپی سال 2002
Pages
-621
From page
622
To page
0
Abstract
The roughness analysis of Chemical vapor deposition (CVD) of copper (Cu) thin films on various substrates with and without seed layers was studied using atomic force microscopy (AFM). The effect of the seed layers on the film morphology was investigated, and none of the seed layers on the substrates improved the film morphology compared with TiN.
Keywords
Nitrogen Nucleophiles , Nitroalkanes , Sulfur Nucleophiles , Carbanions , Oxygen , Phosphorus Nucleophiles , Nitrobenzyl , sp3 Carbons , Heterocyclic Analogues , Regiochemistry , Alicyclic Aliphatic Substrates , Photostimulated Reactions , Geminal Dihalides , stereochemistry , Triorganylstannyl , (alpha)Carbon , Cycloalkyl Halides , Aliphatic Substrates , Carbonylation , Radicals Intermediates , Trihalides , EWG , Neopentyl , sp2 Carbons , Cumyl
Journal title
Journal of Materials Engineering and Performance
Serial Year
2002
Journal title
Journal of Materials Engineering and Performance
Record number
60311
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