Abstract :
The roughness analysis of Chemical vapor deposition (CVD) of copper (Cu) thin films on various substrates with and without seed layers was studied using atomic force microscopy (AFM). The effect of the seed layers on the film morphology was investigated, and none of the seed layers on the substrates improved the film morphology compared with TiN.
Keywords :
Nitrogen Nucleophiles , Nitroalkanes , Sulfur Nucleophiles , Carbanions , Oxygen , Phosphorus Nucleophiles , Nitrobenzyl , sp3 Carbons , Heterocyclic Analogues , Regiochemistry , Alicyclic Aliphatic Substrates , Photostimulated Reactions , Geminal Dihalides , stereochemistry , Triorganylstannyl , (alpha)Carbon , Cycloalkyl Halides , Aliphatic Substrates , Carbonylation , Radicals Intermediates , Trihalides , EWG , Neopentyl , sp2 Carbons , Cumyl
