Title of article
Circular-pad via model based on cavity field analysis
Author/Authors
N.K.، Nikolova, نويسنده , , G.A.، Kouzaev, نويسنده , , M.J.، Deen, نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
-480
From page
481
To page
0
Abstract
An equivalent circuit model of a circular-pad grounding via is proposed based on cavity modal analysis. The modes of the via are derived analytically. Each mode is represented by an equivalent circuit taking into account ohmic losses, as well as losses due to spatial and surface wave radiation. It is shown that the degradation of grounding via characteristics at high frequencies is caused by the multimode effects and radiation. The accuracy of the proposed semi-analytical via model is comparable with that of full-wave analysis up to 75 GHz. It is fast and is easily incorporated in high-frequency circuit simulators.
Keywords
Power-aware
Journal title
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Serial Year
2003
Journal title
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Record number
66121
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