مرکز منطقه ای اطلاع رساني علوم و فناوري - Primary particle and agglomerate size measurement in chemical mechanical polishing (CMP) slurry using electrospray technique

Title of article :

Primary particle and agglomerate size measurement in chemical mechanical polishing (CMP) slurry using electrospray technique

Author/Authors :

Seong-Ho Yoo، نويسنده , , Keung-Shan Woo، نويسنده , , Benjamin Y. H. Liu، نويسنده ,

Issue Information :

ماهنامه با شماره پیاپی سال 1998

Pages :

From page :

867

To page :

868

Keywords :

Electrospray , slurry , primary particle , Size distribution , Chemical mechanical polishing (CMP) , Agglomerate

Journal title :

Journal of Aerosol Science

Serial Year :

1998

Journal title :

Journal of Aerosol Science

Record number :

741742

Link To Document :