Author/Authors :
A.، Deutsch, نويسنده , , G.V.، Kopcsay, نويسنده , , P.W.، Coteus, نويسنده , , C.W.، Surovic, نويسنده , , P.E.، Dahlen, نويسنده , , D.L.، Heckmann, نويسنده , , Duan، Dah-Weih نويسنده ,
Abstract :
This paper compares the major classes of chip-to-chip and on-chips interconnections used in high-performance computers and communication systems and reviews their electrical characteristics. Measurement results of dielectric loss are shown and the attenuation is compared for printed-circuit-board, glass-ceramic, thin-film, and on-chip wiring. Simulation results are shown with representative driver and receiver circuits, guidelines are given for when losses are significant, and predictions are made for the sustainable bandwidths on useful wiring lengths.
