Title of article :
Failure analysis of adhesively bonded structures: from coupon level
data to structural level predictions and verification
Author/Authors :
De Xie، نويسنده , , JAEUNG CHUNG، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2005
Abstract :
This paper presents a predictive methodology and verification through experiment for the
analysis and failure of adhesively bonded, hat stiffened structures using coupon level input data. The
hats were made of steel and carbon fiber reinforced polymer composite, respectively, and bonded to
steel adherends. A critical strain energy release rate criterion was used to predict the failure loads of
the structure. To account for significant geometrical changes observed in the structural level test, an
adaptive virtual crack closure technique based on an updated local coordinate system at the crack tip
was developed to calculate the strain energy release rates. Input data for critical strain energy release
rates as a function of mode mixity was obtained by carrying out coupon level mixed mode fracture
tests using the Fernlund-Spelt (FS) test fixture. The predicted loads at failure, along with strains at
different locations, were compared with those measured from the structural level tests. The predictions
were found to agree well with measurements for multiple replicates of adhesively bonded hat-stiffened
structures made with steel hat/adhesive/steel and composite hat/adhesive/steel, thus validating the proposed
methodology for failure prediction.
Keywords :
fracture toughness of adhesive , mixed-modefracture envelope , Virtual crack closure technique , Adhesively bonded structures , Failure analysis , Strain energy release rates
Journal title :
International Journal of Fracture
Journal title :
International Journal of Fracture