Title of article
Analysis of three-dimensional interface cracks using enriched finite elements
Author/Authors
A. O. Ayhan · A. C. Kaya · H. F. Nied، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
22
From page
255
To page
276
Abstract
Many important interface crack
problems are inherently three-dimensional in
nature, e.g., debonding of laminated structures at
corners and holes. In an effort to accurately analyze
three-dimensional interface fracture problems, an
efficient computational technique was developed
that utilizes enriched crack tip elements containing
the correct interface crack tip asymptotic behavior.
In the enriched element formulation, the stress
intensity factors KI, KII, and KIII are treated as
additional degrees of freedom and are obtained
directly during the finite element solution phase.
In this study, the results that should be of greatest
interest are obtained for semi-circular surface
and quarter-circular corner cracks. Solutions are
generated for uniform remote tension and uniform
thermal loading, over a wide range of bimaterial
combinations. Of particular interest are the
free surface effects, and the influence of Dundurs’
material parameters on the strain energy release
rate magnitudes and corresponding phase angles.
Keywords
Interface cracks · Three-dimensionalcracks · Finite elements · Surface cracks · Cornercracks · Enriched elements · Dundurs’parameters · Phase angle · Stress intensity factors ·Silicon · Epoxy
Journal title
International Journal of Fracture
Serial Year
2006
Journal title
International Journal of Fracture
Record number
828477
Link To Document