مرکز منطقه ای اطلاع رساني علوم و فناوري - Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

Title of article :

Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

Author/Authors :

Y. NAKAMURA، نويسنده , , T. Ono، نويسنده ,

Issue Information :

دوهفته نامه با شماره پیاپی سال 2005

Pages :

From page :

3267

To page :

3269

Journal title :

Journal of Materials Science

Serial Year :

2005

Journal title :

Journal of Materials Science

Record number :

829954

Link To Document :