TEM microstructural analysis of As-Bonded Al–Au wire-bonds

In this study the interface morphology of a model 99.999% (5N) Au wire bonded to Al pads in the as-bonded state was examined by scanning/transmission electron microscopy with energy dispersive spectroscopy. Specimens for transmission electron microscopy were prepared using the lift-out method in a dual-beam focused ion beam system. Analysis of the bond microstructure was conducted as a function of the Al pad content and as a function of the bonding temperature. Additions of Si and Cu to the Al pad affect the morphology and the uniformity of the interface. A characteristic-void line is formed between two intermetallic regions with different morphologies in the as-bonded samples. According to the morphological analysis it was concluded that a liquid phase forms during the bonding stage, and the void-line formed in the intermetallic region is the result of shrinkage upon solidification and not the Kirkendall effect.