Monolithic integration of RF MEMS switches with a diversity antenna on PCB substrate

A novel process for monolithic integration of RF microelectromechanical system (MEMS) switches with three-dimensional antenna elements on a microwave laminate printed circuit board (PCB) is presented. This process calls for a low-temperature (90(degree)C-170(degree)C) high-density inductively coupled plasma chemical vapor deposition technique that allows the choice of any PCB substrate, such as RO4003-FR4 ((epsilon)/sub r/=3.38, tan(delta)=0.002), with the desired electrical properties for antenna applications. A two-element diversity antenna system monolithically integrated with RF MEMS switches is designed and demonstrated.