Title of article
Impact of low-impedance substrate on power supply integrity
Author/Authors
R.، Panda, نويسنده , , S.، Sundareswaran, نويسنده , , D.، Blaauw, نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
-15
From page
16
To page
0
Abstract
Although it is tempting to think of the power grid as an independent medium of the transfer of energy from the package to the devices in the IC, some second-order technology-related effects can sometimes cause unforeseen problems. This article focuses especially on the relationship of the power delivery system to the silicon substrate properties, and shows how a low-impendance substrate can make a substantial difference in the noise generated by the power grid.
Keywords
leukemia
Journal title
IEEE Design and Test of Computers
Serial Year
2003
Journal title
IEEE Design and Test of Computers
Record number
90277
Link To Document