Title of article
Wafer-package test mix for optimal defect detection and test time savings
Author/Authors
P.C.، Maxwell, نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
-83
From page
84
To page
0
Abstract
For years, it has been common to run a test at wafer and then exactly the same test again at package. This article shows how one company took a detailed look at the wafer/package test mix and adjusted it to reduce cost while retaining quality.
Keywords
leukemia
Journal title
IEEE Design and Test of Computers
Serial Year
2003
Journal title
IEEE Design and Test of Computers
Record number
90301
Link To Document