• Title of article

    Wafer-package test mix for optimal defect detection and test time savings

  • Author/Authors

    P.C.، Maxwell, نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2003
  • Pages
    -83
  • From page
    84
  • To page
    0
  • Abstract
    For years, it has been common to run a test at wafer and then exactly the same test again at package. This article shows how one company took a detailed look at the wafer/package test mix and adjusted it to reduce cost while retaining quality.
  • Keywords
    leukemia
  • Journal title
    IEEE Design and Test of Computers
  • Serial Year
    2003
  • Journal title
    IEEE Design and Test of Computers
  • Record number

    90301