Title of article
Issues that impact the conversion to a no-clean surface mount assembly process
Author/Authors
Chan-Jer Yang، نويسنده , , Rohini K. Srihari، نويسنده , , J. DiLella، نويسنده ,
Issue Information
ماهنامه با شماره پیاپی سال 1998
Pages
4
From page
57
To page
60
Abstract
The surface mount assembly industry, especially the contract manufacturing segment, is currently undergoing a transition from an assembly process that requires a cleaning step to one that does not. In addition, maximization of yields is critical to the contract assembly environment. This paper addresses both these issues. Factors that impact the conversion to a no-clean process are discussed along with those that impact first pass yields. A systematic process that can be implemented to maximize yields is provided.
Keywords
Surface Mount Technology , Solder Paste , Printed Circuit Board (PCB) Assembly , No-clean Surface Mount Assembly
Journal title
Computers & Industrial Engineering
Serial Year
1998
Journal title
Computers & Industrial Engineering
Record number
925163
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