• Title of article

    Issues that impact the conversion to a no-clean surface mount assembly process

  • Author/Authors

    Chan-Jer Yang، نويسنده , , Rohini K. Srihari، نويسنده , , J. DiLella، نويسنده ,

  • Issue Information
    ماهنامه با شماره پیاپی سال 1998
  • Pages
    4
  • From page
    57
  • To page
    60
  • Abstract
    The surface mount assembly industry, especially the contract manufacturing segment, is currently undergoing a transition from an assembly process that requires a cleaning step to one that does not. In addition, maximization of yields is critical to the contract assembly environment. This paper addresses both these issues. Factors that impact the conversion to a no-clean process are discussed along with those that impact first pass yields. A systematic process that can be implemented to maximize yields is provided.
  • Keywords
    Surface Mount Technology , Solder Paste , Printed Circuit Board (PCB) Assembly , No-clean Surface Mount Assembly
  • Journal title
    Computers & Industrial Engineering
  • Serial Year
    1998
  • Journal title
    Computers & Industrial Engineering
  • Record number

    925163