Title of article :
Issues that impact the conversion to a no-clean surface mount assembly process
Author/Authors :
Chan-Jer Yang، نويسنده , , Rohini K. Srihari، نويسنده , , J. DiLella، نويسنده ,
Issue Information :
ماهنامه با شماره پیاپی سال 1998
Abstract :
The surface mount assembly industry, especially the contract manufacturing segment, is currently undergoing a transition from an assembly process that requires a cleaning step to one that does not. In addition, maximization of yields is critical to the contract assembly environment. This paper addresses both these issues. Factors that impact the conversion to a no-clean process are discussed along with those that impact first pass yields. A systematic process that can be implemented to maximize yields is provided.
Keywords :
Surface Mount Technology , Solder Paste , Printed Circuit Board (PCB) Assembly , No-clean Surface Mount Assembly
Journal title :
Computers & Industrial Engineering
Journal title :
Computers & Industrial Engineering