Thermal-fluid flow in parallel boards with heat generating blocks

A method is developed to numerically investigate thermal-fluid flow behavior in a bundle of parallel boards with heat producing blocks. The system simulates cooling passages in a stack of electronic circuit boards with heat generating chips. At a low Reynolds number flow, a developing flow may achieve a fully developed flow state at certain block number from the entrance. Thermal conductivity of the board and thermal contact resistance between the chip and board has a considerable impact on thermal performance. The fluid flow and heat transfer performance in this channel flow is similar to that in ribbed channel flow.