Title of article
Application of saccharose as copper(II) ligand for electroless copper plating solutions Original Research Article
Author/Authors
Eugenijus Norkus، نويسنده , , K?stutis Pru?inskas، نويسنده , , Algirdas Va?kelis، نويسنده , , Jan? Ja?iauskien?، نويسنده , , Irena Stalnionien?، نويسنده , , Donald L. Macalady، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2007
Pages
8
From page
71
To page
78
Abstract
Saccharose, forming sufficiently stable complexes with copper(II) ions in alkaline solutions, was found to be a suitable ligand for copper(II) chelating in alkaline (pH > 12) electroless copper deposition solutions. Reduction of copper(II)–saccharose complexes by hydrated formaldehyde was investigated and the copper deposits formed were characterized. The thickness of the compact copper coatings obtained under optimal operating conditions in 1 h reaches ca. 2 μm at ambient temperature. The plating solutions were stable and no signs of Cu(II) reduction in the bulk solution were observed. Results were compared with those systems operating with other copper(II) ligands.
Keywords
Saccharose , Copper(II) , Ligand , Electroless copper deposition , Copper coatings , Surface roughness
Journal title
Carbohydrate Research
Serial Year
2007
Journal title
Carbohydrate Research
Record number
965116
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