Enhanced adherence of electroless metal deposit on SiO2 via control of the chemical environment of the Pd seeding layer

Experimental results are presented on the electroless metallization of SiO2 using the Pd seeding layer obtained by either laser-assisted or thermal decomposition of a Pd acetylacetonate spun-on precursor layer. The processing of the seeding layer in acetic acid results in an enhanced adherence (up to 2 N/mm2) of the Ni deposit to glass and fused quartz. XPS analysis of the seeding layer shows that processing in the acid removes the two acetylacetonate “wings” left after the decomposition of Pd(acac)2 around Pd nuclei. Well-adherent Ni and Cu stripes are deposited onto glass and quartz substrates via laser decomposition of a spun-on Pd(acac)2 layer with 30 μm spatial resolution for a wide range of scanning velocities of the laser beam.