Direct writing of gold and copper lines from solutions

For printed circuit repair and fine pitch wiring a metallization technique is investigated which could be applied in ambient air. Organo-metallic precursors containing gold or copper are dissolved in a variety of solvents and spilled onto the substrate. Dimethylenglykoldimethylether, DME, exhibits best properties with respect to a high solubility of the precursor and slow evaporation of the solvent. With second harmonic Nd:YAG or argon ion laser radiation of 150 mW power metal lines are written on polyimide from organo-gold(I) and copper compounds with a writing speed of 0.6 mm/s. First results of writing on SiC substrates with Nd:YAG laser radiation of 3 W power from PEt3AuCl are reported. Micrographs and measurements of the resistivity of the laser written lines are given.