Abstract :
In atmospheric chemical vapor deposition of silicon with Hz-diluted SiH,Cl, on Si(lll), the kinetics of defect
nucleation for stacking fault, dislocation and poly-Si was investigated as a function of growth temperature and SiH,Cl, flow
rate. In comparison to an Arrhenius plot of growth rate, it was observed that stacking fault and dislocation are nucleated
appreciably in the surface-reaction rate-limited temperature region. Moreover, we found that the stacking fault density
increased as a parabolic function of SiH,Cl, volume concentration, cvO, and the dislocation density increased almost
linearly with c,, while no significant increase was then observed for the poly-Si density. The stacking fault and dislocation
densities had the almost same incubation c,, below which no defects appeared. These observations indicate that the surface
adsorbate gives rise. to the nucleation of stacking fault and dislocation and the surface adsorbate related nucleation
mechanism of stacking fault is different from that of dislocation.
Keywords :
Si CVD , SiH , CI , Surface adsorbate , Crystallographic defect , Surface morphology