Title of article :
Ultrathin silicide formation for ULSI devices
Author/Authors :
R.T. Tung a، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1997
Pages :
7
From page :
268
To page :
274
Abstract :
Recently, the growth of epitaxial CoSi, layers was demonstrated using the oxide mediated epitaxy COME) technique. A thin SiO, interlayer, grown in a peroxide-containing aqueous solution, induced the growth of nearly perfect CoSi, on practically all surfaces of Si. With deposited cobalt, a optimum thickness range of l-3 nm was observed, independent of the doping level and the orientation of the silicon. After the OME growth, the SiO, layer was found to remain largely on the surface and act as a cap of the silicide layer. An interesting result of the surface oxide cap was a significant re-evaporation of cobalt observed during deposition at elevated temperatures. Thicker (lo-30 nm), excellent quality, CoSi, single crystal thin films were grown by repeated growth sequences on Si(lOO), (1 IO), (11 l), (211) and (511). Additionally, OME growth was found not to depend on linewidth and doping level, making it an attractive technique for ULSI applications.
Keywords :
Ultrathin silicide , Kinetics
Journal title :
Applied Surface Science
Serial Year :
1997
Journal title :
Applied Surface Science
Record number :
991798
Link To Document :
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