Abstract :
We have combined some of the major positive advantages of laser-induced forward transfer LIFT.and matrix-assisted
pulsed laser evaporation MAPLE., to produce a novel excimer laser driven direct writing technique which has demonstrated
the deposition in air and at room temperature and with sub-10 mm resolution of active and passive prototype circuit elements
on planar and nonplanar substrates. We have termed this technique MAPLE DW matrix-assisted pulsed laser evaporation
direct write. and present its historical evolution from pulsed laser deposition. This paper describes the simplistic approach to
carry out MAPLE DW, gives experimental conditions, and physical characterization results for the deposition of NiCr thin
film resistors, Au conducting lines, and multilayer depositions of Au conductors and BaTiO3 dielectrics to produce prototype
capacitors. In general, the electrical properties of the materials deposited conductivity, dielectric constant, and loss tangent.
are comparable or superior to those produced by other commonly used industrial processes such as screen printing. The
mechanism of the MAPLE DW process, especially the novel aspects making it a powerful approach for direct writing all
classes of materials metals, oxide ceramics, polymers and composites., is also described. q2000 Published by Elsevier
Science B.V. All rights reserved
Keywords :
Laser deposition , Electronic devices , Matrix-assisted pulsed laser evaporation , Direct writing , Matrix-assisted pulsedlaser evaporation direct write , Thin films