Abstract :
Conductive copper patterns were deposited on polyimide PI. surfaces using a focused, scanned CW Arq laser beam at
488-nm wavelength. The deposition process was initiated by a photothermal reaction of a tartarate–complex solution of
Cu2q ions in an alkaline and reducing medium. Deposits were characterised by Field Emission Scanning Electron
Microscope FESEM., Energy Dispersive X-ray Spectrometry EDS.and resistance measurements. The mass of the
deposited copper mCu.and also the rate of the deposition dmCurdt.were calculated from the resistance measurements.
The dependence of the copper deposition rate on the scanning speed of the laser beam, number of scans, laser power and the
temperature of the solution were examined. It was found that more chemical reactions were running parallel during the direct
writing process yielding metallic copper and copper II.-oxide on the PI surface. q2000 Elsevier Science B.V. All rights
reserved.
Keywords :
Integrated circuits , reaction kinetics , Chemical , Laser Radiation , surface irradiation effects , Polymers , Radiationeffects , deposition , films and coatings , Integrated circuits , Metallization