Title of article
Argon ion treatment of the Dow Cyclotene 3022 surface and its effect on the adhesion of evaporated copper
Author/Authors
D.-Q. Yang، نويسنده , , E. Sacher، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
10
From page
30
To page
39
Abstract
Cyclotene 3022, a low permittivity insulator was subjected to Ar surface treatment in an effort to increase the adhesion of
subsequently evaporated Cu. Photoacoustic FTIR shows the loss of aromaticity and the formation of Si±Hn, where n 2, 3.
XPS evidence suggests that beam damage causes the formation of ±Si±O and ±Si , as well as ±C fragments; both ±Si±O
and ±C react with evaporated Cu0 to form ±Si±O±Cu and ±C±Cu; these bonds to Cu are too weak to prevent lateral surface
diffusion of the Cu to form clusters. # 2001 Elsevier Science B.V. All rights reserved.
Keywords
Cyclotene 3022 , Argon ion , Photoacoustic FTIR , Copper evaporation , Copper adhesion , Sputtering
Journal title
Applied Surface Science
Serial Year
2001
Journal title
Applied Surface Science
Record number
996922
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