Abstract :
Silicon–germanium (SiGe) heterojunction metal-oxide-semiconductor field-effect transistors (SiGe HMOSFETs) have been
successfully fabricated on Si substrate. The semiconductor heterostructure, which was grown by gas-source molecular beam
epitaxy (GS-MBE), was initiated by the deposition of a Si0.7Ge0.3 ‘‘virtual substrate’’. The n-type transistors were fabricated
using a standard MOS process. The channel is a thin, undoped layer of strained Si and is buried below an arsenic-doped
Si0.7Ge0.3 layer, which provides the carriers. The devices exhibited excellent current–voltage (I–V) characteristics in terms of
transconductance and drain current, with no breakdown or leakage. A level-1 model was extracted, for use in circuit design. The
results suggest that the realisation of buried-channel SiGe n-HMOSFETs is feasible in MOS processes. These devices are of
particular importance in analogue applications.
# 2003 Elsevier B.V. All rights reserved.
Keywords :
Si–Ge alloys , band structure , Semiconductor epitaxial layers , MOSFETs , Analogue electronics