Title :
UBM Formation on Single Die/Dice for Flip Chip Applications
Author :
Ioannis M. Besieris )William A. Davis( استاد مشاور , James E. McGrath استاد مشاور , Aicha Elshabini استاد راهنما
University :
Virginia Polytechnic Institute and state University
Major :
Master of Science )Electrical Engineering(
Keyword :
Solder Bump , Under Bump Metallurgy )UBM( , Flip chip , Single Die
